Yong Wang received B.S. degrees in Chemical Engineering and Industrial Engineering (1997) and a M.S. degree in Chemical Engineering (1999) from Tianjin University (Tianjin, P.R.China). He is currently a Ph.D. student in the School of Chemical Engineering at Georgia Institute of Technology.
Yong Wang, and Xien Xu. “Review of the Technology Development of heteropoly acid catalysts”, QILU Petrochemical Technology, Vol.27, No.2, 1999.
Yong Wang, Sue Ann Bidstrup, Guang Yuan, and Mark G. Allen “Printed-Wiring-Board Microfluidics for Thermal Management of Electronic Systems”, ECS 201st meeting, 2002.
Heat Removal using Thermo-Integrated Circuits (HERETIC) funded by Defense Advanced Research Projects Agency (DARPA), Intel and Honeywell Inc.
This research work is focused on the application of organic multilayer lamination of epoxy-glass printed wiring board material to produce microfluidic structures, and the exploitation of these structures along with integrated, low profile synthetic jet drivers, to produce an active cooling substrate (ACS) in which fluidic cooling functionality as well as electrical functionality are incorporated into the same, low-profile substrate.
Schematic of the active cooling substrate
Structure of ACS actuator diaphragm
Schematic of ACS with electromagnetic actuator
Lamination process
ACS device with silicon heater