Semester : Fall 2007
Time: Lecture Th 9:30-11; 3 hour laboratory
Lecturer: Professor Mark G. Allen, 120 Pettit Building, 894-9419
Text: May
and Sze, Fundamentals of Semiconductor Fabrication
Laboratory Instructor: Ms. Laureen Rose, 114 Pettit Building
(laureen.rose@mirc.gatech.edu)
Teaching Assistant: Mr. Avishek Aiyar, MiRC J1
(avishek@gatech.edu)
Office Hours: Thursday 8:30-9:30; or by appointment
Class Web Page: http://mems.gatech.edu
Class Rules
and Regulations:
1.
In both the lecture and laboratory sessions: there is no eating, drinking, or
smoking.
2.
In the laboratory sessions, please note: safety is of the utmost concern in
this class. Although all procedures
in this laboratory are safe if done properly, improper procedures can result in
severe injuries. Therefore, repeated or intentional
disregard for the safety procedures of this course will be grounds for
expulsion from the course and a grade of 'F', regardless of past
performance in the course.
3. Homework in this course
will be assigned in lecture and will consist of writeups of laboratories you
perform during the course (exclusive of the final report, discussed below), and
specific problems. Graded
homeworks (interim laboratories) will be returned to you for review and
modification prior to submission of the final report.
4.
For this laboratory course, you will be divided up into groups of at least
two. The laboratory reports will
be a group effort (i.e., I expect to receive one laboratory report from each
group). ALL other requirements for
the course, including class and laboratory participation, are to be INDIVIDUAL
efforts. If you have any questions
regarding when your fellow students can help you and when they can't, please
see one of your instructors.
5. Because we are on a rigid schedule, and because independent work in the laboratory cannot be allowed due to safety reasons, it is extremely important that you attend EVERY laboratory session. If either you or your partner cannot attend a session, please notify me as soon as possible. In these cases, the laboratory instructor can be 'hired' to process your wafers for you, at a 'cost' of a 10% reduction in your non-exam points for the course per occurrence, except as described below.
6.
There may be several sessions to 'catch up' in the laboratory schedule. In these cases, if you can convince the
laboratory instructor to open the lab, you can make up some sessions without
the penalty described above if YOU do the wafer processing. Note that 'catch-up' sessions may or
may not be useful in any student's particular case, depending on where you are
in the process sequence.
Grading:
Your grade will depend on two exams (20% each); interim laboratory reports (20%, with the majority of the weight being placed on the diffusion report); your final laboratory report (including laboratory notebook) (25%), and participation in both lecture and laboratory (15%). Since it is not possible to participate in lecture and laboratory without attending, attendance will be a part of the participation grade. The laboratory notebook and laboratory report are described in more detail in accompanying handouts.
Exams:
The exams will be held during lecture periods as per the attached schedule. Each exam will be designed to be completed in an hour, and you will have the full class time to work on it. The format of the first exam will be closed book and notes, and the format of the second exam will be open book and notes. Partial credit will be given on all exams. Please note that academic honesty is of paramount importance to insure that the class and grading is fair to all students. Academic dishonesty will not be tolerated. If you have any questions regarding what is and is not allowed, please see me prior to the exam. There will be no make-up exams for this course. A grade of zero will be given for any missed exam for which there have been no arrangements made beforehand, unless you have a written medical excuse.
Topics and Assignments:
|
Lecture Date: |
Topics |
Interim Laboratory Due |
|
August 23 |
Safety Quiz / Orientation |
|
|
August 30 |
Oxidation |
|
|
September 6 |
Photolithography |
|
|
September 13 |
Diffusion I |
Oxidation |
|
September 20 |
SUPREM |
|
|
September 27 |
Exam I |
Exam I |
|
October 4 |
Diffusion II |
|
|
October 11 |
Metallization |
Photolithography |
|
October 18 |
Plasma Etching |
|
|
October 25 |
Ion Implantation |
|
|
November 1 |
CMOS Process |
Diffusion |
|
November 8 |
Characterization I |
|
|
November 15 |
Characterization II |
Metallization |
|
November 22 |
Holiday |
Holiday |
|
November 29 |
Exam 2 |
Exam 2 |
|
December 6 |
Discussion/Help Session |
Final Report |