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MicroSensors and MicroActuators

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Jin-Woo Park (PhD student)

 

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Biographical Sketch

 Jin-Woo Park received the B.S. degree in Electrical Engineering from Sung Kyun Kwan University, Seoul, Korea, in 1996, and the M.S. degree in Electrical and Computer Engineering from Georgia Institute of Technology, Atlanta, in 2000. He is currently pursuing the Ph. D. degree in Electrical and Computer Engineering at Georgia Institute of Technology. His research interests include design, fabrication, and characterization of micromachined magnetic components for power applications with specific emphasis on developing core lamination for high-magnetic-saturation metallic cores.

 

 

Office: 404-894-9909

Fax: 404-894-5028

gte764c@prism.gatech.edu

 

 

Research Topic:

1. Development of the high current and low profile micromachined inductor with laminated Ni/Fe cores

Sponsor: The Defense Advanced Research Projects Agency (DARPA) – 6/1998~9/1999.

2. Development of manufacturable core lamination technology for high magnetic saturation metallic cores in MHz switching power conversion applications.

Sponsor: The Defense Advanced Research Projects Agency (DARPA) and the Army Research Office (ARO) MURI Program – 3/1999~current.

 

Publications:

 

1. Jin-Woo Park, Jae-Yeong Park, Yeun-Ho Joung, and Mark. G. Allen, “Fabrication of high current and low profile micromachined inductor with laminated Ni/Fe core,” IEEE Trans. Component and Packaging Technology, vol. 25, no. 1, March 2002.

2. Jin-Woo Park, Florent Cros, and Mark G. Allen, “A sacrificial layer approach to highly laminated magnetic cores,” in proceedings 15th IEEE International Workshop on Micro Electro Mechanical Systems, Las Vegas, USA, January, 2002, pp. 380-383.

3. Jin-Woo Park, and Mark G. Allen,Ultra low-profile micromachined power inductors with highly laminated Ni/Fe cores: Application to low-megahertz DC-DC converters,” IEEE Trans. Magn., vol. 39, no. 5, Sept. 2003. pp. 3184 –3186.

4. Jin-Woo Park, Florent Cros, and Mark G. Allen,Planar spiral inductos with multilayer micron-scale laminated cores for compact-packaging power converter applications,” IEEE Trans. Magn., (in review).

 

 

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