Current Project:
1) Heat Removal by
Thermo-Integrated Circuits ( HERETIC)
2) Digital CLAY
Published
Papers:
Research of
the sensing circuit for micro-silicon accelerometer,
Journal of Chinese Instrumental science, Mar. 1996
Research of
Micro-silicon inertial sensors,
International MEMS Conference, Japan, Oct. 1997, (2nd
author, )
Design of
multi-finger micro-silicon accelerometer
Journal of Tsinghua University Science and Technology, Vol. 38, Nov. 1998,
p38-41
Mode
Analysis on Micro-mechanical Cantilever Accelerometer
Journal of Tsinghua University Science and Technology, Vol. 38, Nov.
1998,p16-18
A Kind of
dissolved Wafer Process Multi-finger Accelerometer
Conference of Chinese Inertial Technology, Aug. 1999
Printed-Wiring-Board
Micro fluidics for Thermal Management of Electronic Systems
201st ECS meeting, May
12-17, 2002 Philadelphia, PA
Tsinghua University's web site is www.tsinghua.edu.cn
There is another Tsinghua University at XinZhu, Taiwan. That Tsinghua was
divided from our school and moved to Taiwan in 1949.
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